{"id":50,"date":"2025-10-21T17:12:52","date_gmt":"2025-10-21T09:12:52","guid":{"rendered":"https:\/\/raldmoyer.co\/?page_id=50"},"modified":"2025-11-20T14:44:23","modified_gmt":"2025-11-20T06:44:23","slug":"capabilities","status":"publish","type":"page","link":"https:\/\/raldmoyer.co\/es\/capabilities\/","title":{"rendered":"Capacidades"},"content":{"rendered":"

EXCELLENT QUALITY MANAGEMENT<\/strong><\/span><\/h1>\n

Wells built a Quality Management System (QMS) to ensure excellent delivery of printed circuit boards and assembled products. Our QMS structure looks like this:<\/p>\n

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PCB Assembly Capability<\/span><\/strong><\/h2>\n

WELLS delivers end-to-end PCB assembly solutions engineered for precision and speed. Our IPC-certified facilities integrate cutting-edge surface-mount (SMT), ball-grid-array (BGA), and through-hole (THT) technologies with mandatory X-ray validation, enabling complex builds from 1-piece prototypes to 10k+ volume runs. Experience seamless turnkey service with guaranteed functional testing and 24hr express options.<\/p>\n<\/div>\n

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PCB Assembly Lead Times<\/strong><\/td>\nFrom 24 hours to 7days once all parts are ready:<\/p>\n

– Express turnaround: 24-hour assembly after component readiness<\/p>\n

– Standard production: Up to 7-day completion when sourcing from NextPCB\u00a0HQ Online<\/a>(all parts verified)<\/td>\n<\/tr>\n

Component Procurement Options<\/strong><\/td>\nFull turnkey<\/strong>: Comprehensive component sourcing by NextPCB HQ Online<\/td>\n<\/tr>\n
Partial turnkey<\/strong>: Hybrid customer-supplied and NextPCB-sourced parts<\/td>\n<\/tr>\n
Kitted\/Consigned<\/strong>: Complete customer-provided components<\/td>\n<\/tr>\n
Advanced Assembly Technologies<\/strong><\/td>\nSurface Mount Assembly (SMT)<\/strong>: High-precision chip placement<\/td>\n<\/tr>\n
Ball-Grid-Array Assembly (BGA)<\/strong>: 0.25mm pitch with mandatory X-ray validation<\/td>\n<\/tr>\n
Through-Hole Assembly (THT)<\/strong>: Traditional component mounting<\/td>\n<\/tr>\n
Mixed technology<\/strong>: Combined SMT & Thru-hole solutions<\/td>\n<\/tr>\n
Mixed Assembly<\/strong>: Integrated SMT and Thru\u2011hole soldering process (reflow + wave\/manual soldering)<\/td>\n<\/tr>\n
Kit Assembly<\/strong>: Component kitting according to BOM for streamlined manual or automated assembly<\/td>\n<\/tr>\n
Solder Types<\/strong><\/td>\nSubstrate Specialization<\/strong>: Rigid PCBs, Flex Circuits, Metal-Core Boards, Rigid-Flex PCB<\/td>\n<\/tr>\n
Component Types<\/strong><\/td>\nBGA:\u00a00.25mm pitch with X-ray QA<\/strong><\/td>\n<\/tr>\n
Ultra-miniature:\u00a001005\/0402 passives<\/strong><\/td>\n<\/tr>\n
High-density: Fine-pitch components as small as\u00a00.38mm pitch ICs<\/strong><\/td>\n<\/tr>\n
Connectors:\u00a0Hard metric & cable assemblies<\/strong><\/td>\n<\/tr>\n
Cable & Wire<\/strong>: Multiconductor cable and wire harness assemblies, enabling organized, insulated routing of multiple conductors within one outer jacket<\/td>\n<\/tr>\n
Bulk<\/strong>: Loose-packaged discrete components (resistors, capacitors, ICs, etc.)<\/td>\n<\/tr>\n
Assembly Side(s)<\/strong><\/td>\nSingle\/Double Sided<\/strong>: Supports both single- and double\u2011sided board assembly<\/td>\n<\/tr>\n
SMT Parts Presentation<\/strong><\/td>\nCut tape<\/strong>: Components supplied on cut tape, ideal for small quantities<\/td>\n<\/tr>\n
Partial reel<\/strong>: Components on partial reels, suitable for mid\u2011volume usage<\/td>\n<\/tr>\n
Reel<\/strong>: Full\u2011reel packaging, the standard for high\u2011volume SMT components<\/td>\n<\/tr>\n
Tube<\/strong>: Components packaged in tubes, typically for cylindrical or long parts<\/td>\n<\/tr>\n
Tray<\/strong>: Supplied in trays, used for large or sensitive components<\/td>\n<\/tr>\n
Laser-cut stainless steel<\/strong>: Delivered on precision laser\u2011cut stainless steel carriers for high\u2011precision or specialty components<\/td>\n<\/tr>\n
Quality Inspection & Testing Protocols<\/strong><\/td>\nVisual inspection<\/strong>: Manual visual inspection of the PCB using magnifying tools to identify component placement, solder joint quality, and other visible defects.<\/p>\n

AOI Scanning<\/strong>: Utilizes automated equipment to scan the PCB, detecting component absence, solder joint issues, polarity errors, and more.<\/p>\n

BGA placement \u2013 X-RAY checking<\/strong>: Employs X-ray technology to inspect internal solder joint quality of BGA, QFN, and other packages, ensuring no cold solder joints or bridging.<\/p>\n

In-Circuit Test (ICT)<\/strong>: Conducts electrical tests to verify connectivity and functionality of circuits on the PCB, detecting issues like shorts and opens.<\/p>\n

Functional Testing(FCT)<\/strong>: Tests the PCB’s functionality under actual operating conditions to ensure it meets design specifications and performance requirements.<\/td>\n<\/tr>\n

After-Sales Service Commitment<\/strong><\/td>\nShould your assembled PCBs encounter transit issues or potential defects upon delivery, we provide immediate repair and rework assistance. Our dedicated engineering team stands ready to resolve concerns through prioritized communication ensuring swift solutions that maintain project momentum and uphold our quality partnership.<\/p>\n

Support Team:<\/strong><\/p>\n